RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X

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PEI Shi-Lun, Chris E, LI Zeng-Hai, Nikolay A and Ivan V. RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X[J]. Chinese Physics C, 2012, 36(2): 173-178. doi: 10.1088/1674-1137/36/2/013
PEI Shi-Lun, Chris E, LI Zeng-Hai, Nikolay A and Ivan V. RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X[J]. Chinese Physics C, 2012, 36(2): 173-178.  doi: 10.1088/1674-1137/36/2/013 shu
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Received: 2011-04-18
Revised: 2011-05-06
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RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X

    Corresponding author: PEI Shi-Lun,

Abstract: An RF power coupler is one of the key components in a superconducting (SC) linac. It provides RF power to the SC cavity and interconnects different temperature layers (1.8 K, 4.2 K, 70 K and 300 K). The TTF-Ⅲ coupler is one of the most promising candidates for the High Energy (HE) linac of Project X, but it cannot meet the average power requirements because of the relatively high temperature rise on the warm inner conductor, so some design modifications will be required. In this paper, we describe our simulation studies on the copper coating thickness on the warm inner conductor with RRR values of 10 and 100. Our purpose is to rebalance the dynamic and static loads, and finally lower the temperature rise along the warm inner conductor. In addition, to get stronger coupling, better power handling and less multipacting probability, one new cold part design was proposed using a 60 mm coaxial line; the corresponding multipacting simulation studies have also been investigated.

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